ASML and TSMC want the glass plate that carries a chip's pattern, called a photomask, to be twice as wide. On 7 September 2026, ahead of the SPIE BACUS conference in Monterey, the two companies set up a joint industry initiative. It aims to move chipmakers from today's 6-inch photomasks to 12-inch photomasks for High NA extreme ultraviolet lithography, the newest kind of chip-printing machine.