Applied Materials and Intel are teaming up to speed up the chipmaking advances AI computers need. That covers next-generation transistors, the wiring between them, and Intel's Foveros 3D chip stacking. The work will happen at Applied's new EPIC Center in Silicon Valley and at Intel's R&D campus in Hillsboro, Oregon.

Photo: Olaf2 / Wikimedia Commons (CC BY-SA 4.0), cropped